单面四层热电分离铜基板 Single-sided four-layer thermoelectric separation copper substrate
产品说明Product description:
1.成品板厚:1.6mm;成品铜厚:2/2/2/2oz ;导热:400W/mK
1.Finished board thickness: 1.6mm; Finished copper thickness: 2/2/2/2 oz; thermal conductivity: 400W/mK
2.表面工艺: 沉金
2.Surface treatment: Immersion Au
3.广泛应用于大功率COB封装照明产品 ,既满足多层走线 ,又满足高散热需求!
3. Widely used in high-power COB packaged lighting products, it meets both multi-layer circuit and high heat dissipation require