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单面四层热电分离铜基板  Single-sided four-layer thermoelectric separation copper substrate

产品说明Product description:

1.成品板厚:1.6mm;成品铜厚:2/2/2/2oz ;导热:400W/mK

1.Finished board thickness: 1.6mm; Finished copper thickness: 2/2/2/2 oz; thermal conductivity: 400W/mK

2.表面工艺: 沉金

2.Surface treatment: Immersion Au

3.广泛应用于大功率COB封装照明产品 ,既满足多层走线 ,又满足高散热需求!

3. Widely used in high-power COB packaged lighting products, it meets both multi-layer circuit and high heat dissipation require

名称: 单面四层热电分离铜基板
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